ïÔ: D&R SoC News Alert [SoC-NewsAlert@design-reuse.com]
ïÔÐÒÁ×ÌÅÎÏ: 9 ÍÁÑ 2005 Ç. 21:50
ëÏÍÕ: Michael Dolinsky
ôÅÍÁ: D&R SoC News Alert - May 9, 2005
DR SoC News Alert
Design And ReuseDesign And ReuseDesign And Reuse
EETimes Network
May 9, 2005    


Michael,
Welcome to the issue of May 9, 2005 of D&R SoC News Alert, our email update to provide you with the latest news and information in the System-On-Chip Community.

SPONSORED BY: eASIC, Corp.

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  • Embedded 8051 microcontroller

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  • System-on-Chip Monitoring System from RealFast Intellectual Property AB
    DDR I/II Controller Core from Tallika Corp.
    10-bit 80 MSPS Pipeline ADC in 0.13um (low area, low power) from Silicon & Software Systems Ltd.
    QR Matrix Factorization core, Factoring a real-valued, input matrix A into an upper triangular matrix R and a lower triangular matrix Q such that Q . R = A from AccelChip
    MPEG-4/H.263 SelectCore CIF CODEC video from Sarnoff Corp.
    Single Channel 2.5Gbps PCI-Express SerDes from Next Sierra, Inc.
    12-bit, 40 MHz, with SH,1.8 V Pipeline ADC from ChipIdea
    Wanted IPs :
  • 10/100/1000 Ethernet PHY
  • Step down DC-DC Converter
  • Serdes 6.25 Gbs
  • Software must take full advantage of multicore platforms
    Measuring the value of third party interconnects
    FPGAs aid in high-end memory interface design
    Take a scalable approach to fabric interface controller design
    A comprehensive approach for verification of OCP-based SoCs
    Designing Using the AMBA (TM) 3 AXI (TM) Protocol -- Easing the Design Challenges and Putting the Verification Task on a Fast Track to Success
    Interview: Roelandts, president and CEO of Xilinx discusses the shifting balance between FPGAs and ASICs, the role of FPGAs in consumer electronics and supply chain gains
    ADI's data converter business reflects a mixture of standbys and custom brews
    IP/SOC PRODUCTS
    ARC International and Tao Group Provide the Lowest Power Java Solution for Embedded Devices
    Matsushita launches 'integrated platform' chip strategy
    Sarnoff H.264 Decoder Delivers High-Quality Video On Portable Devices, Cell Phones
    LEON3 has passed SPARC V8 compliance testing
    DEALS
    TUV Rheinland selects SeaSolve Software's IEEE 802.15.4 WPAN PHY Layer Compliance Test and Analysis Solution
    Motorola buys TTPCom's AJAR platform
    MIPS Technologies and ITE Technology, Inc. Announce Agreement to License MIPS32 4KE Pro Core Family
    BUSINESS
    Cadence and Faraday Announce Library Collaboration For Nanometer Design
    Zoran Corporation Agrees to Acquire Oren Semiconductor
    Strategy Analytics: Growing Automotive ASIC Market Provides $2.4 Billion Opportunity
    Silicon Image Receives NASDAQ Notifications
    Philips reorganizes semiconductor division
    STMicro FPGA IP up for Grabs
    FINANCIAL RESULTS
    Faraday Monthly Sales Report - April 2005
    LEGAL
    Acacia Technologies Adds Intel and Advanced Micro Devices to Computer Memory Cache Coherency Litigation
    PEOPLE
    Howard Bubb Named CEO of Ambric, a Fabless Semiconductor Start-up
    Abraham Sofaer Joins Rambus Board of Directors
    DESIGN SERVICES
    Cambridge Consultants to help develop next-generation terminal equipment for Iridium Satellite
    EMBEDDED SYSTEMS
    Mentor Graphics and LSI Logic Announce Seamless Product Support for ZSP Processor Cores
    FOUNDRIES
    TSMC Monthly Sales Report - April 2005
    TSMC expands DFM recommendations at 90 nm
    April sales fall 30 percent year-on-year at UMC
    Doubts remain about Chartered Semi's recovery
    SMIC and UTAC to Establish Semiconductor Assembly and Testing Facility in China
    FPGA/CPLD
    Xilinx Expands Signal Processing Portfolio For Digital Communication System Design
    Built for Speed: Quartus II Software Version 5.0 Boosts Stratix II Memory Performance Up to 550 MHz
    Atmel Extends its FPGA to ASIC Conversion Service for Space Applications
    Atmel's FPSLIC II Dynamically Reconfigurable SoC Supports "Silicon-Sharing" For Peripherals & Interfaces
    FABLESS
    Fulcrum Microsystems Raises $20 Million to Expand the Market for its Innovative Interconnect Semiconductors
    EDA
    TransEDA Announces Automatic Verification for AMBA AXI-Based Designs
    OTHER
    Sonics' Research Reveals Dramatic Gains in Volume, Market Share, and Profits Using Third-Party Intelligent Interconnect Strategy for SoC Design

    SPONSORED BY: ALPHA TECHNOLOGIES

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